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CreCon - Consortium for Climatically Reliable Electronics
CreCon is an industrial consortium under CELCORR aiming at providing continuous support to industries on climatic reliability issues. Prospective consortium memebers are companies who wish to get support in on reliability issues of their products at various levels. CELCORR group through CreCon consortium provides reliability support to a number of industries through research, product support, testing, advice, net-working, unique laboratory facilities, skills development, education, and a member only datat base website providing information on all aspects of climatic reliability. Participation of companies in the consortium is through an yearly modest membership fee, while the return on the investment is many times higher than the membership fee.
More informaton on CreCon consotium...
Part of CreCon activities include research and development directed by the industrial members of the consortium. Following are the CreCon subprojects identified for the year 2011 - 2012, and consortium members can get complete access to knolwedge from these R&D activities, while directing their needs through similar sub-projects.
Sub-project (CSP1/2011): Improving performance of conformal coatings for PCBA applications
Aim of this sub-project is to bench mark the presently available conformal coating for their performance on PCBA with cleanliness levels presently used in the industries, and arrive at any simple modification that is possible from cleanliness aspects, application of coating, or modification of coating.
More information.. (Only for members)
Sub-project (CSP2/2011): Identification of best cleanliness levels for climatic reliability
This sub-project will focus on developing specification for best cleanliness levels during production for PCBA with an aim to improve climatic reliability. Aim is to arrive at acceptable levels of cleanliness and its cause and effects in connection with application environment of the device. This sub-project will look in to the cleanliness levels specified by various IPC standard and their pros and cons, and arrive at feasible limits on various types of contamination on the PCBA. Project will also look into the connection between PCBA manufacturing aspects and cleanliness eg. Type of flux, solid content of flux etc.
More information.. (Only for members)
Sub-project (CSP3/2011): Design factors for climatic robustness of electronics
Various design related factors related to PCBA and device can influence the climatic reliability. This sub-project will investigate design related aspects at various levels starting from components, PCBA circuit design and placing of components, thermal aspects of PCBA during working to encapsulation design including novel design concepts for encapsulation to control humidity effects using concepts from indoor climate control.
More information.. (Only for members)
Sub-project (CSP4/2011): Limits of test methods and standards
Various standards and test methods used for climatic reliability testing of electronics has several drawbacks. This sub-project will aim to have a deep look into various standards and test methods for their application, and advantages/disadvantages, and what changes should be suggested from the available knowledge.
More information.. (Only for members) | 