Research in CELCORR

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Innovation consortium for sustainable performance in electronics

The effect of exposed climatic conditions on the functioning electronic device is a serious threat today due to a number of factors among which a key aspect is that the device enclosures are not strictly designed today to minimize the effect of the exterior climate (especially humidity and gases) on the interior parts of the device. Temperature variation is unavoidable to a great extent, while the uncontrolled humidity synergistically with temperature variation is more problematic. The IN SPE project aims to develop an industrial level methodology for “Enclosure design for electronic devices” for improving its climatic reliability.