Climatic reliability of Electronics: Global challenges and Perspectives

5-6 March, 2020

Technical University of Denmark, 2800 Kgs. Lyngby, Denmark

During the past couple of decades, use of electronics have increased in gigantic proportions. Use of power electronics in various sectors is a typical example as well as electrification of automotive sector. The device needs to be highly reliable for use in various climatic conditions.  Humidity can cause reliability issues in electronics resulting in intermittent malfunctions and permanent failures; many of them are due to transient water film formation on PCBA surface under climatic exposure. Therefore understanding, finding preventive measures, and design for humidity robustness is important. There can be extrinsic methods keeping humidity level low or intrinsic methods increasing the robustness of the PCBA and components. As such preventive measures can be individually or used in combination.
Following previous years successful seminars, we are pleased to announce the 5th international seminar on climatic reliability of electronics. The two days seminar will cover various aspects of humidity issues in electronics elucidating failure mechanisms, influencing factors, humidity and climate modelling, and various preventive measures. This is a focussed seminar with invited talks delivered by experts in various areas from industry and academia on various issues.  
The seminar attracts delegates from academia and industry. We are delighted to invite you to attend this important seminar.

Register here for attending the seminar:

Contacts for information :
Professor Rajan Ambat, CELCORR, DTU : This email address is being protected from spambots. You need JavaScript enabled to view it.
Dr. Morten Jellesen, CELCORR, DTU : This email address is being protected from spambots. You need JavaScript enabled to view it.


 Day 1 Thursday – 5th March 2020

08.30 – 09.00

        Registration and coffee

Session 1

Humidity interaction with PCBA and failure mechanisms

09.00 – 09.30

Overview of the seminar, and perspectives on the humidity effects on electronics

Rajan Ambat / CELCORR, DTU, Denmark

09.30 – 10.00

Corrosion behavior of printed electronics with silver traces

Laura Frisk / Trelic, Finland

10.00 – 10.30

Corrosion investigations on Bi and Mn micro-alloyed lead-free SAC alloys

Bálint Medgyes /BME, Budapest

10.30 – 11.00

        Coffee break

Session 1 (Cont.)

Humidity interaction with PCBA and failure mechanisms

11.00 - 11.30

Electrochemical corrosion and thermal effects at voltages ≥ 12 V in electronics systems

Nicolas Mayer/ Automotive Electronics, Robert Bosch, Germany

11.30 – 12.00

Carbonization of PCB material in relation to thermal incidents

Lutz Muller / Automotive Electronics, Robert Bosch, Germany

12.00 – 13.00

        Lunch Break

Session 2

        Importance of process and service related residues

13.00 – 13.30

Interaction of PCBA materials and reflow residue: Compatibility and Reliability Assessment

Daniel Buckland / Henkel, United Kingdom

13.30 – 14.00

Does the measurement of ionic contamination predict reliability? Realization of IPC-J-STD001G-Am1 in the automotive Industry

Henneken Lothar /Automotive Electronics Robert Bosch, Germany

14.00 – 14.30

A validation tool for SMT-flux residues by infrared-spectroscopy based multi variate data analysis

Richter Theresia / Automotive Electronics Robert Bosch, Germany

14.30 – 15.00

Chemical composition, evolution, deliquescence and conductivity of aerosol deposited on the insulators of the Italian national power lines

Luca Ferrero / University of Milan Biccoca, Italy

15.00 – 15.30

        Coffee break

Session 3

        Humidity and reliability of high power/low power systems and components

15.30 – 16.00

Studies on sprayed metal (schoopage) as humidity barrier in film capacitor

Lucia Cabo / TDK Electronics Components, Spain

16.00 – 16.30

Beyond humidity testing: Mixed Flowing Gas Tests on Power Electronics

Tommi Kärkkäinen / LUT University in Lappeenranta, Finland

16.30 – 17.00

Humidity-induced failures in state-of-the-art power semiconductor devices

Christian Zorn / University of Bremen, Germany

17.00 – 17.15

        Frist day summary and bus transport to the dinner location

17.45 – 21.30

        Seminar Dinner



 Day 2 Friday – 6th March 2020

08.15 – 08.30

        Arrival and coffee

Session 3 (Cont.)

Humidity and reliability of high power/low power systems and components

08.30 – 09.00

Comparison of PCBs and DBCs concerning ECM and formation of dendrites

Chen Weiy / Fraunhofer Institute for Integrated Systems and Device Technology IISB, Germany

09.00 – 09.30

Field failures of electronics and power capacitors in railway applications:
Breakdown related to environmental conditions and proposed countermeasures

Roland Schmid / Bombardier Transportation, Switzerland

09.30 – 10.00

Study of the degradation of different thermoelectric modules at Teide volcano

Leyre Catalán Ros / Universidad Pública de Navarra, Spain

10.00 – 10.30

Challenges and requirements for reliable sinter interconnections

Meier Dr. Markus /Zestron, Germany

10.30 – 11:00

        Coffee break

Session 4

        Humidity robustness testing, characterization methods and standards

11.00 – 11.30

Alternative Detection methods for Humidity Impacts on PCBAs

Lauser Simone /Automotive Electronics Robert Bosch, Germany

11.30 – 12.00

Complementary EIS / FTIR study of the degradation of adhesives in electronic packaging

Michael Schneider /Fraunhofer-Institut für Keramische Technologien und Systeme IKTS, Germany

12.00 – 13.00

        Lunch Break

Session 4 (Cont.)

        Humidity robustness testing, characterization methods and standards

13:00 – 13.30

Component Specific Test Boards and Electrical Test Methods for Assessing the Climatic Reliability of PCBAs

Mike Bixenman / Kyzen, USA

13.30 – 14:00

Reliability standards for cleanliness: Protecting the future

Emma Huson / GEN3 Systems, United Kingdom

Session 5

        Extrinsic methods for prevention of humidity effects

14.00 – 14.30

Mission profiling and corrosion classification: importance in relation to humidity effects on electronics

Morten Jellesen / CELCORR, DTU, Denmark

14.30 – 15.00

        Coffee break

15.00 – 15.30

Ultra-thin Fluoropolymer Coating: Performance and its use in Electronics

Mélanie Mathon / Inventec Performance Chemicals, France

15.30 – 16.00

Moisture absorption by polymer materials and impact on enclosure design

Helene Conseil / Sankhya Mohanty/ DTU, Denmark

16.00 – 16.10

Conclusion and summary

Rajan Ambat / CELCORR, DTU, Denmark





Details of venue for the seminar:
DTU Building 101, Meeting Room 1
Anker Engelundsvej 1
2800 Kgs. Lyngby


Getting there:

Some of the hotels near to the DTU campus are:

Scandic Eremitage, Lyngby (1.6 km)

Gentofte Hotel, Gentofte (4.5 km)

Hotel Schæffergården, Gentofte (3.0 km)

Copenhagen is about 15 km away from the DTU campus and there are many possibilities for hotels. Easiet mode of transport from you hotel to DTU can be found here:


Social programme on 1st Seminar day evening:




Seminar Dinner at Restaurant Charlottenlund Fort, Strandvejen 150, 2920 Charlottenlund 


This seminar is organized by:

Centre for Electronic Corrosion (CELCORR), DTU
European Federation of corrosion (EFC), WP 23 on Corrosion Reliability of Electronics
European Centre for Power Electronics (ECPE)



EFC logo ECPE logo CMYK


 Here you can find the links to the full programs of the previous yearly CELCORR seminars:

1st Yearly CELCORR climatic reliability seminar - 2016

2nd Yearly CELCORR climatic reliability seminar - 2017

3rd Yearly CELCORR climatic reliability seminar - 2018

4th Yearly CELCORR climatic reliability seminar - 2019